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Logo for Conference 2027 Logo for Conference 2027

March 1–5, 2027

Philadelphia

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SEI at ASCE2027

ASCE2027 promotional graphic for March 1 to 5 in Philadelphia, Structural Engineering Institute.
Why SEI?

Structural Engineering Institute

SEI is joining ASCE’s other institutes to create a new conference experience that preserves the strengths of Structures Congress while adding new ways to engage across disciplines. At ASCE2027, you’ll find the high‑quality technical content, meaningful recognition, and strong peer connections you expect along with broader collaboration on forward‑looking topics shaping the built environment. SEI is curating a focused structural engineering program featuring sessions on buildings, bridges, structural codes and standards, professional practice, innovative research, and more. ASCE2027 will offer expanded avenues to share knowledge, exchange perspectives, and connect with experts across institutes on issues influencing practice today and tomorrow. SEI looks forward to ASCE2027, an experience offering structural engineers new avenues for engagement and inspiration.

ASCE2027 Speakers Component Image

ASCE2027 keynote speaker

ASCE is pleased to announce the first of four keynote speakers. Dr. Ayanna Howard, Ph.D., for ASCE2027: The Infrastructure and Engineering Experience. Howard is the Dean of The Ohio State University College of Engineering and one of the industry's foremost experts in AI.

Learn more about Dr. Howard

SEI Student & Young Professional Scholarships

Connect, learn, and grow with SEI/ASCE!

Scholarships (complimentary registration and travel/lodging reimbursement) for SEI members to participate in ASCE2027 | March 1–5, 2027 in Philadelphia, and get involved in SEI/ASCE are provided by the SEI Futures Fund. Student membership to ASCE/SEI is free, as well as the first year after graduation.

To help scholarship recipients make the most of their conference networking/learning experience, they will be assigned an SEI member volunteer as an informal mentor prior to the conference. This informal mentor involvement is intended to help answer the scholarship recipients’ questions and make connections through the conference, for continuing involvement in SEI/ASCE. If interested in further mentoring, see Home - Mentoring.


Student Scholarship

Eligibility: Must be a current full-time student (undergrad or grad student enrolled in civil engineering or similar program), a current SEI member (one Institute is free with ASCE membership). Preference will be given to those who have not attended an SEI/ASCE professional conference previously.

Make sure to review the application requirements, the areas of evaluation, and what needs to be included in your application BEFORE applying.

Apply by: November 20, 2026

    Application requirements

    Provides complimentary student registration, and travel reimbursement post-conference from SEI for: economy travel with at least 14-day advance purchase within the US and $175 per diem (toward lodging and any other cost) for up to four nights for participation March 1-5, 2027 in Philadelphia.

    Note: This is not full cost reimbursement. Other costs are the participant’s responsibility.

    Application evaluated on:

    • Career goals
    • Research and/or Internships
    • Volunteer work and/or professional organization participation
    • GPA (US equivalent) or stated need of support are used by committee when scores are close

    Travel funding is reimbursable to recipients following the conference with completion of these requirements (program event schedule TBA):

    • Participate in a brief welcome orientation on site (and conference call prior to conference)
    • Attend 1-2 SEI committee meetings (one of which should be the SEI Student Engagement Committee)
    • Attend the SEI Meet the Leaders event • Participate in SEI focus events at the conference
    • Submit feedback on the experience

    Apply by: November 20, 2026

    Applicants will be notified of acceptance by December 18, 2026.


Young Professional Scholarship

Eligibility:

  • Must be a young professional (35 years or younger) SEI member in industry or academia with intent to become more involved with SEI. Up to 5 scholarships are available for full-time young professional teaching faculty through age 40.
  • Limited to one time per recipient
  • Students are not eligible

Make sure to review the application requirements, and what needs to be included in your application BEFORE applying.

Apply by: November 20, 2026

    Application requirements
    • Tier 1 (14 available): Complimentary registration, travel reimbursement (economy travel within US with at least 14-day advance purchase), and up to $175 per diem (toward lodging and any other cost) for four nights for participation March 1-5, 2027 in Philadelphia. Includes up to 5 scholarships for young professional full-time teaching faculty through age 40.
    • Tier 2 (6 available): Complimentary registration and up to $500 total reimbursement toward travel and any other cost
    • Tier 3 (10 available): Complimentary registration only

    Applicants must select which tier level(s) they want to be considered for and be able to participate no matter which award they receive. Selection of multiple tiers will not affect consideration for the higher tier awards.

    Note: This is not full cost reimbursement. Other costs are the participant’s responsibility.

    Application Includes:

    • Resume or curriculum vitae (1-2 pages)
    • Two narrative statements
    • Essay

    Travel funding is reimbursable to recipients following the conference with completion of these scholarship requirements (program event schedule TBA):

    • Participate in a brief welcome orientation on site (and conference call prior to conference)
    • Attend 1-2 committee meetings (one of which should be the Young Professional Engagement Committee)
    • Attend the SEI Meet the Leaders event
    • Participate in SEI focus events at the conference
    • Submit feedback on the experience

    Apply by: November 20, 2026

    Applicants will be notified of acceptance by December 18, 2026.

Thank you to our sponsors

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Logo for ASCE2027 - The Infrastructure and Engineering Experience

March 1–5, 2027

Philadelphia

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